Portrait oriented case: Difference between revisions

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The case thickness is set by the components, the current case design is 18mm thick, which is made up of
The case thickness is set by the components, the current case design is 18mm thick, which is made up of


2mm for the front bezel
* 2mm for the front bezel
4.5mm for the LCD
* 4.5mm for the LCD
9.5 for components = 9mm for the battery +0.5mm for a foam pad to hold it OR 1mm space under PCB, 1mm for PCB and 7mm for a Telit module and 0.5mm  
* 9.5 for components = 9mm for the battery +0.5mm for a foam pad to hold it
2mm for back case
OR 1mm space under PCB, 1mm for PCB and 7mm for a Telit module and 0.5mm  
* 2mm for back case
= 18mm total
= 18mm total



Revision as of 08:45, 27 February 2007

Case and Component Models

This is a second attempt at a case design, starting from scratch with a different approach. Since all component parts are dimensioned in mm, this case is also in mm. It is constructed as an assembly model, and each component part is modelled separately. These parts can easily be imported into other modelling packages, they are used to figure out internal layout, and to help specify mounting points.

The case thickness is set by the components, the current case design is 18mm thick, which is made up of

  • 2mm for the front bezel
  • 4.5mm for the LCD
  • 9.5 for components = 9mm for the battery +0.5mm for a foam pad to hold it
  • OR 1mm space under PCB, 1mm for PCB and 7mm for a Telit module and 0.5mm
  • 2mm for back case

= 18mm total

The 3D printer can't go as thin as injection molded cases. Its like a 3D jigsaw puzzle.... The Telit module has a slot for a SIM card that would be accessed by removing the battery, that sets its position and orientation, that sets the GSM and GPS antenna connectors orientation. The GPS antenna is 25mm square, although I did find a smaller part online, I don't see a source for it. This is located in the front plane alongside the LCD, which I moved up to one end to make more space....

The design is being created using Alibre Express, which is a free-for-a-month Windows based entry level parametric CAD package with some advanced features disabled. The part files will be available in Alibre native format and in IGES, and the case design will be available in STL format ready to be printed on the 3D printer. Work in progress shown below: MyPhone37front.jpg MyPhone37back.jpg